Hi,

Could you review schematic and pcb design, especially integrated antenna. If you do, please contact me from registered email.

Thanks.

Hello

I work with da14585 and da14586 chips.

From phones I use:

iPhone xs iOS14

iPhone 11 iOS 13

Samsung galaxy s8 Android 9

Pixel 4 with Android 10

I use bonding and all worked well on the SDK 6.0.10

Then on the forum, when I asked about PWM, your engineers advised me to update from SDK6.0.10 to SDK6.0.14 according to the tutorial.

And now I have a bug with pairing.

On the device, 585 everything works well on the new SDK6.0.14.

But when I run my code for device 586 I get pairing failed with reason: "The pairing procedure cannot be performed as authentication requirements cannot be met due to IO capabilities of one or both devices."

I have the next security settings:

#define USER_CFG_FEAT_IO_CAP GAP_IO_CAP_DISPLAY_ONLY
#define USER_CFG_FEAT_OOB GAP_OOB_AUTH_DATA_NOT_PRESENT
#define USER_CFG_FEAT_AUTH_REQ (GAP_AUTH_BOND | GAP_AUTH_MITM | GAP_AUTH_SEC)
#define USER_CFG_FEAT_KEY_SIZE 0x10
#define USER_CFG_FEAT_SEC_REQ GAP_SEC1_SEC_PAIR_ENC
#define USER_CFG_FEAT_INIT_KDIST (GAP_KDIST_ENCKEY | GAP_KDIST_IDKEY | GAP_KDIST_SIGNKEY)
#define USER_CFG_FEAT_RESP_KDIST (GAP_KDIST_ENCKEY | GAP_KDIST_IDKEY | GAP_KDIST_SIGNKEY)

Hi,

I am designing to prototype with da14586. Most of the components footprints are very small packages like 0402 and 0201. Can i substitute these parts at least with 0603 sizes ?

Also, do u have any suggestions for hand soldering for da14586 and other components ?