⚠️
Hi there.. thanks for coming to the forums. Exciting news! we’re now in the process of moving to our new forum platform that will offer better functionality and is contained within the main Dialog website. All posts and accounts have been migrated. We’re now accepting traffic on the new forum only - please POST any new threads at//www.wsdof.com/support. We’ll be fixing bugs / optimising the searching and tagging over the coming days.
2 posts / 0 new
Last post
samuel.benketaf...
Offline
Last seen:3 years 7 months ago
Joined:2017-05-15 15:19
通过作为60-VFQFN停机坪package

Hi dear support

Can I use a standard via as a landing pad ?

In the hardware application notes AN-B-061, they recommend 250um square landing pads.
Vias have a 200um drill hole, 125um width contact ring, total diameter 450um)

It would help me to reduce cost and increase density to use standard via right under the pins.

Thank you in advance for your response.

Device:
MT_dialog
Offline
Last seen:1 month 2 weeks ago
Staff
Joined:2015-06-08 11:34
Hi samuel.benketaf,

Hi samuel.benketaf,

Please check below the response from the hardware team,

This application is possible, but the hole in the via must be copper filled or resin filled and plated to a smooth flat surface for a good and reliable solderability. This may be expensive:

There are other, unrelated problems, in the given example:

  • Ground connections use very thin lines at some distance from the vias. This will not work good in respect to RF performance, EMC and EMI.
  • The 16MHz crystal seems to have unusual pinout (2-3 signals, 1-4 gnd). Normally the pinout is like attached.

Thanks MT_dialog