Hi all.
我们正在使用DA14580与STM32L152VE在启动过程中上传的DSP。
Now, we are watching unstable behaviour during paring process with different smartphones.
You know it is unreachable code in your module,so,could you please建议我
any tool, application or method for debugging paring process in order to resolve our problems.
I saw that you provide CLI, but please draw your attention - we don't use OTP,
however上传the ble firmware from "main" MCU.
还有一个问题：
I suppose that you checked this device (DA14580) with different samples of mobile devices.
How did you check it ?
Could you please let me know what are the samples ?
I mean, what are operating systems? What are manufactures ?
And any other information that can be useful for us.
Thanks a lot for your time and consideration
SYQE医疗
瓦莱里
Hi etai,
Could you please kindly explain what you mean with the “paring process”? Do you mean the pairing procedure when the security is enabled, or you cannot connect your DA14580 with another peer device?
关于第一种情况，请注意，Biretooth LE中的配对具有不同的含义，它指的是安全功能。DSP参考应用程序代码不使用安全功能，因此设备之间没有配对。当连接指示到达外围设备时执行的功能是user_on_connection，并且在建立连接时也在中央执行相同的功能。如果您想在DSP上添加安全性，SDK5.0.4有一个例子是如何在580上实现安全性的示例，您可以将其视为示例。该项目位于5.0.4 \ projects \ target_apps \ ble_examples \ ble_app_security文件夹路径下。
Regarding the second case, do you have a custom board, or you are using any of our development boards? Your DA14580 acts as central or as a peripheral? In case of the peripheral, could you please check if is advertising? You could use the power profiler od SmartSnippets toolbox for this scope.
I would strongly recommend you to have a look at the DSPS user manualUM-B-038：对话框串行端口配置文件的用户手册（DA14580）user manual.
Also, be aware that any further inputs would be very helpful as you question is little bit generic.
Thanks, PM_Dialog
Hi
通过配对过程,我的意思是客y exchange and then bonding the device with a smartphone by storing the pairing data. I have enabled security in DSPS, it's currently set to :
.oob = gap_oob_auth_data_not_present，
.key_size = KEY_LEN,
.iocap = GAP_IO_CAP_NO_INPUT_NO_OUTPUT,
.auth = gap_auth_req_no_mitm_bond，
.sec_req = GAP_SEC1_NOAUTH_PAIR_ENC,
.ikey_dist = GAP_KDIST_SIGNKEY, // | GAP_KDIST_IDKEY,
.rkey_dist = GAP_KDIST_ENCKEY,
We use our own custom board for the product. 14580 acts as peripheral, to the STM32L1 main MCU. Since there is no flash on 14580, once the pairing is successful, we wait until the pairing is complete, then we use the .app_on_pairing_sucess callback to save the pairing data and transfer it to the main MCU. Our issue is that there are discrepancies between the pairing process on different smartphones. Sometimes, the callback triggers and we get the pairing data, but the on the phone side pairing fails, and our pairing data is corrupted.
Our issue is that from what I've seen, the pairing process data exchange itself is handled by your kernel on ROM, and I only get limited control and debug through ke_** messages. Is there any way, or any tools for more in-depth debug of the pairing process?
当用不同的智能手机模型测试时，配对的行为也明显不同。我们始终看到设备广告，然而，在任何模型上，配对过程都有更多关于某些Android模型的问题。这就是为什么我们询问是否以及如何测试模块与不同的手机型号。
Thanks again
SYQE医疗
瓦莱里
Hi
通过配对过程,我的意思是客y exchange and then bonding the device with a smartphone by storing the pairing data. I have enabled security in DSPS, it's currently set to :
.oob = gap_oob_auth_data_not_present，
.key_size = KEY_LEN,
.iocap = GAP_IO_CAP_NO_INPUT_NO_OUTPUT,
.auth = gap_auth_req_no_mitm_bond，
.sec_req = GAP_SEC1_NOAUTH_PAIR_ENC,
.ikey_dist = GAP_KDIST_SIGNKEY, // | GAP_KDIST_IDKEY,
.rkey_dist = GAP_KDIST_ENCKEY,
We use our own custom board for the product. 14580 acts as peripheral, to the STM32L1 main MCU. Since there is no flash on 14580, once the pairing is successful, we wait until the pairing is complete, then we use the .app_on_pairing_sucess callback to save the pairing data and transfer it to the main MCU. Our issue is that there are discrepancies between the pairing process on different smartphones. Sometimes, the callback triggers and we get the pairing data, but the on the phone side pairing fails, and our pairing data is corrupted.
Our issue is that from what I've seen, the pairing process data exchange itself is handled by your kernel on ROM, and I only get limited control and debug through ke_** messages. Is there any way, or any tools for more in-depth debug of the pairing process?
当用不同的智能手机模型测试时，配对的行为也明显不同。我们始终看到设备广告，然而，在任何模型上，配对过程都有更多关于某些Android模型的问题。这就是为什么我们询问是否以及如何测试模块与不同的手机型号。
Thanks again
SYQE医疗
瓦莱里
Hi
You could use the power profiler od SmartSnippets toolbox for this scope.
SmartSnippets Toolbox如何帮助我们。它仅用于编程和加载固件，进入SRAM，OTP和Flash。
谢谢。
Hi etai,
We don’t have any specific tool for this scope. You could use a sniffer in order to check the messages that are exchanged over the air. Did you follow the ble_app_security example of the SDK? Regarding the SmartSnippets toolbox, there is included a tool named Power Profiler and you can check if your device is advertising or not. But as you mentioned, youρ device is advertising correctly. For your information, with the usage of SmartSnippets toolbox you are not able to download firmware into the System-RAM. You can only burn the SPI Flash or the OTP.
Thanks, PM_Dialog
是的，我使用了SDK示例adding security.
第二个问题怎么样？你能向我解释你是如何检查这个设备的？
What smartphones models did you check it with?
Android? iPhone? What operating systems? What manufactures?
提前致谢
瓦莱里
Hi etai,
I would suggest you to have a look atTutorial 5 : Pairing , Bonding & Securitytutorial for more information regarding the security in DA14580.
Thanks, PM_Dialog