GreenPAK
Programmable Mixed-signal Matrix
GreenPAK™ is a broad family of cost effective NVM programmable devices that enable innovators to integrate many system functions into a single custom circuit, and in the process minimize component count, board space, and power consumption. Using Dialog's GreenPAK Designer Software and GreenPAK Development Kit, designers can create and program your perfect custom circuit in minutes.
Benefits
Benefits Over Discrete Design
较小的PCB占地面积- 塑料包装小于1.0 x 1.2 mm。
更少的组件/较低的成本– A typical GreenPAK implementation removes from ten to thirty components per instance.
更高的可靠性– Fewer PCB interconnects increases reliability.
更快的设计– Develop and program devices in minutes at your desk. Quickly respond to changing design requirements and increase productivity at the design and prototype verification stages.
较低的力量– Save power by removing discrete resistors in voltage dividers, pull ups, pull downs, etc. and replacing with low-power, integrated components. Further reduce power consumption using the sleep function.
设计安全- 通过禁用NVM配置的回读，模糊设计细节，使逆向工程更加困难。
Tested Solutions– Every GreenPAK IC is tested, while a discrete circuit is not tested prior to the final board level test.
雷竞技安卓下载
GreenPak是理想的
功能替代流行的混合信号标准产品，通常组合。雷电竞官网登录
Providing reliable hardware safety and reset functions for software coded devices, such as SoCs and microcontrollers.
添加不同的功能。
克服最后一分钟的设计挑战/问题。
Unique Feature Subsets
双电源GreenPak.
灵活接口两个独立电压域
GreenPak与电源开关
Configure the GreenPAK, while at the same time control high drive current power switches
GreenPAK with Asynchronous State Machine
Develop your own custom state machine designs
GreenPAK with Low Drop Out Regulators
发现“灵活权力岛屿”的概念
GreenPAK with In-System Programmability
通过编程非易失性存储器（NVM），轻松修改配置或添加功能到设备
高压GreenPaks
Take best advantage of the combined mixed-signal logic and high-voltage H-bridge functionality
汽车Greenpaks.
将许多系统功能集成到单个AEC-Q100合格的IC中
模拟GreenPaks.
Create your own unique analog circuits combined with GreenPAK configurable logic
Development boards
GreenPAK DIP Development Board
Perfect for breadboarding and fast prototypes.
GreenPak高级开发板
使用任何GreenPak设备在几分钟内进行定制样本。
GreenPAK Pro Development Board
使用SELECT GreenPak设备在几分钟内进行定制样本。
活动
让我们去配置
Links to previously recorded webinars
25.June 2020
go配置网络研讨会
7月7日7月7日
go配置：使用HV Pak获取电机运行
2020年7月14日
使用GreenPak，在几分钟内进行配置和测试汽车混合信号电路
| PN. | Special Feature | GPIO. | 名义VDD. （v） |
ACMP. | DCMP / PWM. | 最大限度。CNT/DLY | 最大限度。luts. | 最大限度。DFF | 管道 Delay |
progr。d | osc. | COM。界面 | 包装尺寸（mm） | Socket | 文件 |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SLG46127 | 2x P-FET | 6 | 1.8 - 5.0 | 2 | - | 4 | 10. | 4 | 8-stage | 1 | RC OSC. | - | 1.6 x 2.0 mm | MSTQFN-16 (#1) | Documentation |
| SLG46580 | asm.我愿意 | 9 | 2.5 - 5.0 | 4 | - | 5 | 16. | 9 | 16.-stage | 1 | Conf。osc.LP OSC | I²C. | 2.0 x 3.0 mm | STQFN-20 (#3) | Documentation |
| SLG46582 | asm.我愿意 | 9 | 2.5 - 5.0 | 4 | - | 5 | 16. | 9 | 16.-stage | 1 | Conf。osc.LP OSC | I²C. | 2.0 x 3.0 mm | STQFN-20 (#3) | Documentation |
| SLG46583 | asm.我愿意 | 9 | 2.5 - 5.0 | 4 | - | 5 | 16. | 9 | 16.-stage | 1 | Conf。osc.LP OSC | I²C. | 2.0 x 3.0 mm | STQFN-20 (#3) | Documentation |
| SLG46585. | asm.我愿意DCDC. | 9 | 2.5 - 5.0 | 4 | - | 5 | 16. | 9 | 16.-stage | 1 | Conf。osc.LP OSC | I²C. | 3.0 x 3.0 mm | MSTQFN-29 (#1) | Documentation |
| SLG46533 | - | 18. | 1.8 - 5.0 | 4 | - | 7 | 25. | 15. | 16.-stage | 1 | Conf。osc.戒指OSC.Crystal OSC | I²C. | 2.0 x 2.2 mm 2.0 x 3.0 mm |
MSTQFN-22（＃1）STQFN-20 (#1) | Documentation |
| SLG46538. | asm.双供货 | 17. | 1.8 - 5.01.8 - VDD1 | 4 | - | 7 | 17. | 8 | 16.-stage | 1 | Conf。osc.RC OSC.Crystal OSC | I²C. | 2.0 x 3.0 mm 2.0 x 2.2 mm |
STQFN-20 (#2)MSTQFN-22（＃2） | Documentation |
| SLG46538-A. | asm.双供货 | 17. | 1.8 - 5.01.8 - VDD1 | 4 | - | 7 | 17. | 8 | 16.-stage | 1 | Conf。osc.RC OSC.Crystal OSC | I²C. | 3.5 x 3.5毫米 | TQFN-20. | Documentation |
| SLG46537. | asm. | 18. | 1.8 - 5.0 | 4 | - | 7 | 17. | 8 | 16.-stage | 1 | Conf。osc.RC OSC.Crystal OSC | I²C. | 2.0 x 3.0 mm 2.0 x 2.2 mm |
STQFN-20 (#1)MSTQFN-22（＃1） | Documentation |
| SLG46536. | - | 12. | 1.8 - 5.0 | 3 | - | 7 | 25. | 15. | 16.-stage | 1 | Conf。osc.戒指OSC.Crystal OSC | I²C. | 2.0 x 2.2 mm | STQFN-14 (#2) | Documentation |
| SLG46535 | asm.双供货 | 11. | 1.8 - 5.01.8 - VDD1 | 3 | - | 7 | 17. | 8 | 16.-stage | 1 | Conf。osc.戒指OSC.Crystal OSC | I²C. | 2.0 x 2.2 mm | STQFN-14（＃3） | Documentation |
| SLG46534. | asm. | 12. | 1.8 - 5.0 | 3 | - | 7 | 17. | 8 | 16.-stage | 1 | Conf。osc.RC OSC.Crystal OSC | I²C. | 2.0 x 2.2 mm | STQFN-14 (#2) | Documentation |
| SLG46170 | - | 12. | 1.8 - 5.0 | - | - | 8 | 17. | 6 | 16.-stage | 1 | RC OSC. | - | 2.0 x 2.2 mm | STQFN-14 (#2) | Documentation |
| SLG46169 | - | 12. | 1.8 - 5.0 | 2 | - | 7 | 18. | 6 | 16.-stage | 1 | RC OSC. | - | 2.0 x 2.2 mm | STQFN-14 (#2) | Documentation |
| SLG46108 | - | 6 | 1.8 - 5.0 | - | - | 4 | 10. | 4 | 8-stage | 1 | RC OSC. | - | 1.0x 1.2 mm | STQFN-8（＃1） | Documentation |
| SLG46121 | 双供货 | 9 | 1.8 - 5.01.8 - VDD1 | 2 | - | 4 | 16. | 8 | 8-stage | 1 | RC OSC. | - | 1.6 x 1.6 mm | STQFN-12（＃2） | Documentation |
| SLG46621 | 双供货8位ADC | 17. | 1.8 - 5.01.8 - VDD1 | 6 | 3/3 | 10. | 26. | 12. | 16阶段2 | 2 | LF OSC戒指OSC.RC OSC. | spi. | 2.0 x 3.0 mm | STQFN-20 (#2) | Documentation |
| SLG46620 | 8位ADC | 18. | 1.8 - 5.0 | 6 | 3/3 | 10. | 26. | 12. | 16阶段2 | 2 | LF OSC戒指OSC.RC OSC. | spi. | 2.0 x 3.0 mm 6.5 x 6.4 mm |
STQFN-20 (#1)TSSOP-20 (#1) | Documentation |
| SLG46620-A. | 8位ADC | 18. | 1.8 - 3.3 | 6 | 3/3 | 10. | 26. | 12. | 16阶段2 | 2 | LF OSC戒指OSC.RC OSC. | spi. | 6.5 x 6.4 mm | TSSOP-20 (#1) | Documentation |
| SLG46117 | 1x P-FET | 7 | 1.8 - 5.0 | 2 | - | 4 | 10. | 4 | 8-stage | 1 | RC OSC. | - | 1.6 x 2.5 mm | STQFN-14（＃1） | Documentation |
| SLG46116 | 1x P-FET | 7 | 1.8 - 5.0 | 2 | - | 4 | 10. | 4 | 8-stage | 1 | RC OSC. | - | 1.6 x 2.5 mm | STQFN-14（＃1） | Documentation |
| SLG46140 | 8位ADC | 12. | 1.8 - 5.0 | 2 | 3/3 | 4 | 16. | 6 | 16.-stage | 1 | LF OSC戒指OSC.RC OSC. | spi. | 1.6 x 2.0 mm | STQFN-14（＃1） | Documentation |
| SLG46120 | - | 10. | 1.8 - 5.0 | 2 | - | 4 | 16. | 8 | 8-stage | 1 | RC OSC. | - | 1.6 x 1.6 mm 2.0 x 2.0 mm |
STQFN-12（＃1） | Documentation |
| SLG46110 | - | 8 | 1.8 - 5.0 | 2 | - | 4 | 10. | 4 | 8-stage | 1 | RC OSC. | - | 1.6 x 1.6 mm | STQFN-12（＃1） | Documentation |
| SLG46722 | - | 18. | 1.8 - 5.0 | - | - | 8 | 17. | 6 | 16.-stage | 1 | RC OSC. | - | 2.0 x 3.0 mm | STQFN-20 (#1) | Documentation |
| SLG46721. | - | 18. | 1.8 - 5.0 | 4 | - | 7 | 18. | 6 | 16.-stage | 1 | RC OSC. | - | 2.0 x 3.0 mm | STQFN-20 (#1) | Documentation |
| SLG46824 | In-System Programmability双供货 | 17. | 2.5 - 5.01.8 - VDD1 | 2 | - | 8 | 19. | 17. | 16.-stage | 1 | RC OSC.LP OSC戒指OSC. | I²C. | 2.0 x 3.0 mm 6.5 x 6.4 mm |
STQFN-20 (# 4)TSSOP-20 (#2) | Documentation |
| SLG46826 | In-System Programmability双供货 | 17. | 2.5 - 5.01.8 - VDD1 | 4 | - | 8 | 19. | 17. | 16.-stage | 1 | RC OSC.LP OSC戒指OSC. | I²C. | 2.0 x 3.0 mm 6.5 x 6.4 mm |
STQFN-20 (# 4)TSSOP-20 (#2) | Documentation |
| SLG46827-A. | In-System Debug双供货 | 17. | 2.5 - 5.01.8 - VDD1 | 4 | - | 8 | 19. | 17. | 16.-stage | 1 | RC OSC.LP OSC戒指OSC. | I²C. | 6.5 x 6.4 mm | TSSOP-20 (#2) | Documentation |
| SLG46880. | asm.双供货 | 28. | 2.5 - 5.02.5 - VDD1. | 4 | - | 5 | 12. | 5 | 16.-stage | 1 | RC OSC.LP OSC戒指OSC.Crystal OSC | I²C. | 4.0 x 4.0 mm | STQFN-32（＃1） | Documentation |
| SLG46881 | asm.双供货 | 28. | 2.5 - 5.01.0 - 1.8 | 4 | - | 5 | 12. | 5 | 16.-stage | 1 | RC OSC.LP OSC戒指OSC.Crystal OSC | I²C. | 4.0 x 4.0 mm | STQFN-32（＃1） | Documentation |
| SLG46517. | asm.2x P-FET | 16. | 1.8 - 5.0 | 4 | - | 7 | 17. | 8 | 16.-stage | 1 | RC OSC.戒指OSC.Crystal OSC | I²C. | 2.0 x 3.0 mm | MSTQFN-28 (#1) | Documentation |
| SLG46855 | - | 12. | 2.5 - 5.0 | 4 | - | 8 | 23. | 21. | 16.-stage | 1 | RC OSC.LP OSC戒指OSC. | I²C. | 1.6 x 2.0 mm | STQFN-14（＃1） | Documentation |
| SLG46855-A. | - | 12. | 2.5 - 5.0 | 4 | - | 8 | 23. | 21. | 16.-stage | 1 | RC OSC.LP OSC戒指OSC. | I²C. | 3.0 x 3.0 mm | FCQFN-14（＃1） | Documentation |
| SLG46867 | 2x P-FET | 10. | 2.5 - 5.0 | 4 | - | 8 | 23. | 21. | 16.-stage | 1 | RC OSC.LP OSC戒指OSC. | I²C. | 1.6 x 3.0 mm | MSTQFN-20（＃1） | Documentation |
| SLG47105 | 双供货4 Half- / 2 Full- bridgesI/V Regulation | 84 x HV | 2.5 - 5.03.3 - 12.0 | 2 | 0/2 | 5 | 17. | 15. | 16.-stage | 1 | LP OSC戒指OSC. | I²C. | 2.0 x 3.0 mm | STQFN-20 (#5) | Documentation |
| SLG47004 | op amp.数字变阻器模拟开关自动修剪In-System Programmability | 8 | 2.5 - 5.0 | 3 | 0/0 | 7 | 20. | 18. | 16.-stage | 1 | RC OSC.LP OSC戒指OSC. | I²C. | 3.0 x 3.0 mm | STQFN-24（＃1） | Documentation |
| SLG88103 | op amp. | 0 | 1.8 - 5.0 | 0 | 0/0 | 0 | 0 | 0 | - | 0 | - | - | 2.0 x 2.0 mm | STDFN-10. | Documentation |
| SLG88104 | op amp. | 0 | 1.8 - 5.0 | 0 | 0/0 | 0 | 0 | 0 | - | 0 | - | - | 2.0 x 3.5毫米 | STQFN-20 | Documentation |
| SLG46811 | 92 x 8位图案发生器 | 10. | 2.5 - 5.0 | 1 (4) | 0/0 | 6 | 18. | 17. | 4 x 8位sh reg | 1 | 戒指OSC. LP OSC |
I²C. | 1.6 x 1.6 mm | STQFN-12（＃1） | Documentation |
我们的合作伙伴网络是为客户提供的咨询服务和应用程序支持。我们的合作伙伴在可配置的混合信号产品中展示了能力，并有助于补充您自己的工程资源。雷电竞官网登录
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1600孟加拉博士，圆岩，78664，德克萨斯州 |
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4787 Line 42 Perth E., RR1, Sebringville, N0K 1X0, Ontario |
| ADOM Ingenieria | 我们专注于模拟和数字电子要求的专业设计，开发，支持和咨询。 | 阿根廷 |
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Isokatu 8A1, Oulu, 90100 |
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Kurt-Schumacher Strasse 1,85221，Dachau |
| Edaxi UG（Haftungsbeschraenkt） | Consulting and engineering for Embedded Systems based on microcontrollers, SoC and other programmable logic. | 德国 |
Maria-Merian-str。6，Monheim Am Rhein，40789 |
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Via Castiglione dOrcia, 28, Roma, 149 |
| Francesco没有 | Francesco没有is an Italian consultant in the Embedded Electronics Engineering field, actively helping customers to turn their Ideas into Products. | 意大利 |
通过Lobbia 3 / B，Mena，33010 |
| PROTASET LIMITED. | 服务：混合信号硬件设计，PCB布局，固件和嵌入式软件开发，数据和通信安全咨询，项目管理。 | 英国 |
2 Bellevue Road Barnes，SW13 0BJ，伦敦 |
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Hoevenstraat 1a，8161，pp Epe |
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| Formilab Pty Ltd | Formilab is a hardware accelerator focused on rapid prototyping and short-run production of consumer electronics and IoT devices. | Australia |
5/10吉利斯街，埃塞森州北，3041，维多利亚州 |
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12.4 Hoang Quoc Viet Street, Cau Giay District, Hanoi Capital City |
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1011西方大道，套房1000西雅图，WA 98104 |
| Indesign，LLC. | Indesign，LLC.is a multi-discipline engineering design firm that provides full turnkey electronic product development to allow clients to get their new product ideas into the market quickly. Indesign offers complete product development capabilities, starting with a product concept and finishing with a ready-to-manufacture design. Indesign has an ISO certified product development process and a proven track record for on-time, on-budget, high quality product realization. Indesign provides specific design engineering services and expertise in electrical design, RF/wireless design, embedded software design, and mechanical design. Indesign also provides engineering services and expertise in a variety of other technical areas including systems engineering, human factors, project management and product validation testing. Indesign engineers can complement a client’s in-house design engineering staff, working in partnership with clients on joint development projects. | 美国 |
8225 e 56th Street，印第安纳波利斯，于46216 |
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2个星期前
STQFN-20中SLG46537的热阻
张贴了ShawnKeller40分 3回复Does anyone have the thermal resistance numbers for the SLG46537 in STQFN-20? The only thing the datasheet reveals is a max junction temp of 150°C. I need the info to tell me how quickly it will get there!
1 week ago
嗨，我们正在研究这个。不好意思推迟了。谢谢约翰